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Quality and Reliability

Xilinx is committed to deliver products with highest levels of quality to multiple markets of the Adaptable Intelligent World, on time every time. We achieve this through partnerships with customers, suppliers and technology stakeholders with our culture of innovation and operational excellence.


Quality-driven innovation is at the heart of everything we do at Xilinx. It’s a commitment that unites employees, suppliers, and stakeholders in a common mission to put customers first: listening, understanding, executing to address their business requirements and delivering products with a “zero-defect” target.?


Figure 1.?Xilinx quality represented by customer scorecard (rating 0 to 10) and defect PPM. These are direct customer feedback scores in which 20% are perfect 10s.

Quality Certifications

Xilinx has built these standards into the company's business fabric to benefit all customers regardless of market.

  • ISO9001 Certification
    Xilinx has a long history of third-party Quality Management System (QMS) certification going back as far as 1995. Currently Xilinx QMS and all major Xilinx sites are certified to ISO9001 for the design, manufacture, and test of programmable solutions. Xilinx’s TL9000 certification spanned from 2004 to 2019 and still compliant.
  • IATF 16969 Certification
    Xilinx certification spanned from 2005 to 2010 and still compliant. Our key suppliers are IATF ISO/TS16949 certified.
  • QML per MIL-PRF-38535
    Certification for compliance with the Department of Defense MIL-PRF-38535 performance specification.
  • Stack Certification
    STACK International certification demonstrates Xilinx's over 25-year uninterrupted commitment to the Aerospace and Defense (A&D) industry and extends its existing quality portfolio including ISO 9001 certified for quality management systems and QML Certifications for compliance with the Department of Defense MIL-PRF-38535 performance specification. Xilinx also provides the world's leading Neutron Single Effects testing and characterization capability with its Rosetta program.

Xilinx continues to adopt new emerging standards to improve its management systems and challenge industry bests.

Environment & Safety

Xilinx Global approach to Environment, Health & Safety (EHS) has been developed on a partnering platform that encourages unity, communication and teamwork throughout all our regional sites and departments within Xilinx.

We use the global environmental management standard ISO 14001 and occupational health and safety standard OHSAS 18001 as the foundation of our EHS management system. Our operating regions communicate with each other to share standards, programs, and practices to ensure global EHS requirements are implemented and maintained in order to:

  • Continually improve the quality of our employee’s work environment;
  • Continually increase EHS performance by lowering risk; and
  • Sustain compliance in all regions

We monitor resource and regulatory trends and are committed to setting focused targets for our key resources and emissions. Our global environmental programs and practices have been developed to identify, manage and control activities that have an environmental impact. We focus on reducing energy consumption where possible, using renewable resources, reducing the solid and chemical waste of our operations, avoiding and preventing pollutions, and minimizing our overall environmental impact in the communities around us.

Pb-Free and RoHS

Xilinx is committed to ensuring the highest levels of compliance across the many standards that govern different industry management systems.

Xilinx offers lead free (Pb-Free) components that comply with the European Union’s RoHS directive (2002/95/EC). RoHS compliant devices are specified by adding the character “G” to the package designator portion of the part number. Under current directive, Xilinx flip-chip packages are exempt from the lead-free requirement under Exemption 15 (Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages). Flip-chip packages that are fully 6 of 6 RoHS compliant without exemption 15 are specified by adding the character “V” to the package designator portion of the part number.

Material declaration data sheets and IPC 1752 forms are posted under Packaging Specifications. Instructions on how to locate these files are in AR# 21227.

Xilinx offers our standard devices which contain lead but comply with the RoHS Directive limits for mercury, hexavalent chromium, cadmium, PBB and PBDE.

Halogen Free and Green package is per IEC61249-2-21

Additional information can be requested using Service Portal.



Generational Quality Report

Title Date

Quality Annual Report

This report showcases the accomplishments of several of the global Xilinx engineering teams who are responsible for the many milestones successfully reached at 28nm, 20nm and 16nm FinFET.

Quality Annual Report 2013
Quality Annual Report 2011
Quality Annual Report 2010
Quality Annual Report 2009
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